Topic: Gluing chips to circuit boards, improved adhesion in the flow process. Lead-free flow soldering.
Gluing Chips to Circuit Boards
to circuit boards in a cost-effective procedure called a wave
soldering process. Up-to-date processes to accomplish this are
typically lead-free. Wave soldering involves a higher temperature
soldering bath, however, which in turn places greater demands on the
adhesion of those
components to the printed
Plasma surface activation for improved adhesive performance
activation of the components’ surfaces and the chips using Openair®
plasma has shown a significant improvement in the performance of the
adhesive used to fix the components in place for further processing
in the solder bath.
back to main topic Wafers/Chips